2.5D and 3D ASIC design technologies-2.5D SoC SiP-HBM 3D-stacked-DRAM technology - Bangalore

Saturday, 31 December, 2022

Item details

City: Bangalore, Karnataka
Offer type: Offer

Contacts

Contact name contentone987
Phone 08041780200

Item description

HBM3/2E/2 IP Subsystem The HBM3/2E/2 IP is suitable for applications involving graphics, high-performance computing, high-end networking, and communications that require very high bandwidth, lower latency and more density.