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Die-to-Die IP Subsystem-Die-to-Die Interposer I/O - Bangalore
Saturday, 31 December, 2022Item details
City:
Bangalore, Karnataka
Offer type:
Offer
Item description
Die-to Die IP Subsystem offers a unique value proposition in terms of low power, high throughput, and low latency links enabling faster time to integration for heterogenous chipset connections in wired communications, AI and HPC applications